Non-contact, non-destructive measurement
Two operating modes: adaptive and fast detection
Multiple blended algorithms cover different film thickness ranges
Open software interface for adding new materials
Semiconductor thin films such as SiO2, SiC, and Si3N4
Photoresists, optical coatings, and other thin films
Thin films of polyimide, epoxy resin, etc.
Thin films on optical substrates such as optical glass and sapphire
Item | Parameter |
Model | BIX-8804-01 |
Film Thickness Range | 50 nm – 70 μm |
Repeatability | 0.1 nm* |
Max. Measurement Speed | ≤1 s |
Wavelength Range | 350 nm – 1050 nm |
Focal Spot Size | 2 mm |
Light Source | Tungsten-halogen lamp |
*Measured on a SiO2 sample with a single measurement time longer than 1s.
