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Application Note: From Bare Die to Module – BRM-6301 Divergence Angle Test Guide for Light Emitters

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    — One Test Platform for All Packaging Levels, from Divergence Angle to Full Device Characterization


    application-note-from-bare-die-to-module-brm-6301-divergence-angle-test-guide-for-light-emitters.jpg


    Overview

    In optical communications, LiDAR, industrial processing, medical aesthetics, and many other fields, laser diodes (LDs), LEDs, and emerging emitters such as Micro-LEDs serve as light-emitting devices. Their performance directly determines the overall system behavior. Divergence angle – a key parameter that measures the "directivity" of a beam – is often the critical factor affecting system coupling efficiency, collimation design, and beam quality.


    However, as shown in Figure 1, light-emitting devices span a broad spectrum of packaging levels – from fragile bare dies, to COS (Chip on Submount) mounted on heat sinks, to TO-packaged devices with lenses, and ultimately to complete modules. Each packaging level imposes different requirements on test systems. Traditional beam profilers can only measure emitters with small far-field divergence angles and are ineffective for large-divergence devices.


    This is where BRM-6301 stands out – its defining strength lies in seamless adaptability across virtually all packaging levels, enabling you to standardize testing across different device types on a single platform.


    figure-1-packaging-levels-of-light-emitting-devices.jpg


    Figure 1: Packaging levels of light-emitting devices – from unpackaged (bare die) to partially packaged (COS) to fully packaged (TO/Butterfly) devices


    Brolight's BRM-6301 Divergence Angle Analyzer is an automated test platform purpose-built to address these challenges. Together with the OPTIED Control & Data Platform and a complete product ecosystem including drivers, temperature controllers, spectrometers, optical power meters, and fixtures, we deliver integrated photonics test solutions from device to system level.


    This guide starts with the real challenges faced by the industry, explains our solutions, and highlights the significance of divergence angle data for downstream applications.


    Part 1: Key Challenges in Photonics Chip and Device Industries

    Throughout the entire lifecycle of light-emitting device R&D, pilot production, mass production, and reliability verification, engineers frequently encounter the following challenges:


    Challenge 1: Difficulty in Testing Across Different Packaging Levels

    Important Note on Array Devices: The BRM-6301 divergence angle analyzer currently does not support batch testing of array-type light-emitting devices (such as VCSEL arrays, Micro-LED arrays, laser bars, etc.). For fine angular characteristic studies of individual chips, it can be configured with a high-precision probe station and microscopic imaging system for single-point testing.


    Classified by emission mode and packaging level, BRM-6301 covers the following device categories:

    Classification

    Category

    Package Format

    Testing Considerations

    Emission Mode

    Edge-Emitting Laser (EEL)

    Bare die, COS, TO package, Butterfly package

    Fast-axis divergence is large (30–40°), requiring full-angle coverage; slow-axis divergence is smaller (10–15°), requiring high angular resolution

    Surface-Emitting Laser (VCSEL)

    Single emitter, TO package

    Smaller divergence angle (~20–25°), good beam symmetry

    LED

    Single chip, COB package

    Lambertian emission, broad angular distribution, requiring half-intensity angle measurement

    Packaging Level

    Unpackaged (Bare Die)

    Bare die

    Requires precision probe station for electrical contact and TEC temperature-controlled base for thermal stability

    Partially Packaged (COS)

    Chip on Submount

    BRM-6701 mounting socket with built-in TEC

    Fully Packaged (TO)

    TO-Can (5.6mm/9mm)

    BRM-6701 mounting socket, plug-and-play

    Fully Packaged (Butterfly)

    Butterfly (14-pin)

    BRM-6711 mounting socket with DB9 interface

    Custom Package

    User-defined package

    Custom fixture service available

    The BRM-6301 Advantage: Whether you are testing edge-emitting or surface-emitting devices, at any packaging level from bare die to Butterfly package, BRM-6301, together with the BRM-67xx series temperature-controlled mounting sockets, delivers a plug-and-play, quick-switch testing experience. One platform, all packaging levels – this is the defining value proposition of BRM-6301.


    Challenge 2: Inability to Measure Large-Divergence Devices

    Traditional beam profilers rely on CCD or CMOS imaging principles and are limited by sensor size and optical system design. They can typically only measure emitters with small far-field divergence angles. For large-divergence laser diodes (such as some edge-emitting lasers), traditional methods are simply incapable. Figure 2 illustrates the conventional camera-based measurement scheme.


    As documented in the literature, a diode laser bar is characterized by two divergence angles: approximately 40° (FWHM) in the fast axis direction and 10° (FWHM) in the slow axis direction. These large, asymmetric divergence angles make efficient optical coupling particularly challenging.

    figure-2-principle-of-traditional-beam-profiler.jpg

    Figure 2: Principle of traditional beam profiler


    Challenge 3: Incomplete Testing and Data Silos

    In many laboratories, divergence angle is measured with one system, while P-I-V curves (power-current-voltage), threshold current, and wall-plug efficiency (WPE) are measured with another. Data cannot be correlated across systems, making it difficult for researchers to understand how temperature and drive current affect divergence angle from a holistic perspective.


    Challenge 4: Lack of Temperature Control, Poor Test Repeatability

    Light-emitting device performance is highly temperature-dependent – wavelength drift coefficient is 0.03–0.1 nm/°C, and divergence angle also varies with temperature. Without precise temperature control, test data lack comparability.


    Challenge 5: Testing Challenges with Emerging Devices like Micro-LED

    With the rapid advancement of display technologies, Micro-LED has gained significant attention as a next-generation display technology. However, the miniaturized nature of Micro-LED presents new testing challenges:


    Challenge

    Specific Manifestation

    Testing Requirement

    Extremely small size

    Chip size typically <100μm, some even <10μm

    High-precision probe station + microscopic imaging system

    Complex angular characteristics

    As chip size decreases, angular emission develops a double-peak profile; significant angular differences among RGB chips

    Accurate angular distribution measurement of individual chips

    Color shift issues

    Mismatched emission angles of RGB chips cause color shift at different viewing angles

    Angle-resolved testing capability to evaluate color deviation


    Special Characteristics of Micro-LED Angular Emission Distribution: Studies show that as Micro-LED chip size decreases, the angular emission profile exhibits a distinct double-peak phenomenon, which is more pronounced in blue and green Micro-LEDs than in red Micro-LEDs of the same size. Additionally, red chips inherently have smaller emission angles than blue/green chips, and encapsulation materials further amplify the emission angles of blue/green light, leading to correlated color temperature (CCT) deviations. These characteristics make divergence angle testing an essential requirement for Micro-LED device evaluation.


    Testing Method Note: For single Micro-LED chips, the BRM-6301 can be paired with a high-precision probe station and microscopic imaging system for detailed angular characteristic studies.



    Part 2: Brolight Integrated Photonics Test Solution

    2.1 BRM-6301 Automated Divergence Angle Analyzer

    The BRM-6301 is an automated divergence angle analyzer specifically designed for large-divergence laser diodes. Its measurement scheme is shown in Figure 3, addressing the challenge that traditional beam profilers cannot measure large-divergence emitters.


    figure-3-brm-6301-divergence-angle-analyzer-measurement-scheme-top-view-side-view.jpg

    Figure 3: BRM-6301 divergence angle analyzer measurement scheme (Top View & Side View)


    Specifications:


    brm-6301-automated-divergence-angle-analyzer-specifications.jpg




    Key Capabilities:

    • Large-Divergence Measurement: Specifically designed for large-divergence emitters, with no limitation on divergence angle magnitude

    • Multi-Packaging-Level Adaptability – the defining differentiator: Flexible configuration with detector and mounting socket options tailored to the emitter's wavelength, power, and packaging level – from bare die to Butterfly package, all on one platform

    • Multiple Output Formats: Supports both polar and Cartesian coordinate angle distribution plots, with automatic half-intensity angle data output

    • One-Click Report Generation: Automatically compiles measurement data into test report format for easy archiving and customer delivery

    • LED Compatible: Also suitable for angular distribution measurement of LEDs


    2.2 Complete Test Ecosystem: Driver, Temperature Controller, and Fixtures Integration

    As shown in Figure 4, the BRM-6301 is not an isolated tester but a primary component of Brolight's complete photonics test ecosystem:


    Product Series

    Model/Series

    Function

    Significance for Divergence Angle Testing

    Divergence Angle Analyzer

    BRM-6301

    Angular distribution measurement

    Primary measurement unit

    Laser Driver Controller

    BRM-610X Series

    Programmable drive current for LD

    Simultaneous analysis of P-I-V curves, threshold current, WPE

    TEC Temperature Controller

    BRM-620X Series

    Precise device temperature control (±0.1°C)

    Ensures test repeatability; enables temperature-divergence relationship studies

    Temperature-Controlled Mounting Sockets

    BRM-67xx Series

    Adapts bare die, COS, TO, and other packaging levels

    Plug-and-play, quick packaging-level switching – the foundation of multi-level adaptability

    Spectrometers

    BIM-60 Series, BIM-66 Series

    Optical emission spectrum measurement

    Spectrum-temperature relationship studies; wavelength drift analysis

    Optical Power Meters

    BIM-740x Series, BIM-710x Series

    Output optical power measurement

    Power-temperature relationship studies; thermal efficiency evaluation

    Control & Data Platform

    OPTIED

    Unified instrument control, data acquisition, and analysis

    Breaks data silos; enables correlative analysis across all test parameters


    figure-4-complete-led-ld-photonics-characterization-test-ecosystem.jpg

    Figure 4: Complete LED/LD photonics characterization test ecosystem


    2.3 Fixture Adaptation Solutions Across All Packaging Levels

    The BRM-6301's ability to adapt to virtually any device packaging level is made possible by the BRM-67xx series temperature-controlled mounting sockets. The table below illustrates the comprehensive coverage:


    Packaging Level

    Recommended Mounting Socket

    Temperature Control

    Drive Method

    Typical Users

    Unpackaged (Bare Die)

    Custom probe station fixture

    Requires TEC temperature-controlled base

    Probe contact

    Chip design houses

    Partially Packaged (COS)

    BRM-6701 (TO-Can socket)

    Built-in TEC, ±0.1°C

    Pin contact

    Assembly houses, device manufacturers

    Fully Packaged (TO)

    BRM-6701 (TO-Can socket)

    Built-in TEC, ±0.1°C

    Standard pins

    Module houses, system integrators

    Fully Packaged (Butterfly)

    BRM-6711 (Butterfly socket)

    Built-in TEC, ±0.1°C

    DB9 interface

    Optical transceiver module manufacturers

    Micro-LED Single-Chip Research

    Custom high-precision probe station

    Requires TEC temperature-controlled base

    Probe contact

    Display chip R&D institutions


    Key Differentiator: Unlike traditional systems that require complex reconfiguration or custom fixtures for each packaging level, BRM-6301 offers standardized, plug-and-play adaptability – drastically reducing setup time and eliminating measurement inconsistencies across different packaging levels.


    figure-5-unpackaged-bare-die-testing-example.jpg

    Figure 5: Unpackaged (bare die) testing example


    2.4 OPTIED Control & Data Platform: The "Central Nervous System" for Instrument Integration

    Brolight's OPTIED Control & Data Platform has fully integrated all devices – BRM-6301 divergence angle analyzer, BRM-610X driver controller, BRM-620X temperature controller, BIM-60/66 series spectrometers, and BIM-740x/710x series optical power meters – into a unified ecosystem for instrument control, data acquisition, and correlative analysis. Figure 6 shows a typical OPTIED interface.


    figure-6-optied-control-data-platform-interface.jpg


    Figure 6: OPTIED Control & Data Platform interface


    Researchers can easily obtain:

    • Divergence angle distribution (polar/Cartesian coordinates) at specific temperatures

    • Divergence angle trends as a function of drive current

    • P-I-V curve comparisons at different temperatures

    • Correlative analysis of divergence angle with threshold current and WPE

    • Spectrum-temperature relationship curves: Using BIM-60/66 series spectrometers to analyze wavelength drift coefficients and evaluate device thermal stability

    • Optical power-temperature relationship curves: Using BIM-740x/710x series optical power meters to evaluate temperature impact on output power and optimize thermal management design

    • One-click export of comprehensive multi-parameter reports


    This means: Researchers no longer need to manually export/import data between different software applications. They can directly explore fundamental scientific questions – "How does temperature affect divergence angle?", "How does drive current influence beam quality?", "How does the spectrum drift with temperature?" – all within a single integrated environment.


    Part 3: Significance of Divergence Angle Data for Downstream Applications

    3.1 Optical Communications – Fiber Coupling Efficiency Optimization

    In optical transceiver modules, light emitted from the laser must be efficiently coupled into optical fibers. The divergence angle directly determines the coupling lens design parameters and coupling efficiency.


    Application Scenario

    Impact of Divergence Angle

    Testing Value

    Single-Mode Fiber Coupling

    Divergence angle determines collimating lens focal length

    Accurately measure divergence angle to optimize lens design and improve coupling efficiency

    Multi-Mode Fiber Coupling

    Divergence angle affects numerical aperture (NA) matching

    Ensure divergence angle ≤ fiber NA to avoid energy loss

    Silicon Photonics Integration

    Spot size matching to waveguide mode field

    Provides input parameters for grating coupler or edge coupler design


    Typical Users: Optical transceiver module manufacturers, silicon photonics chip design houses


    3.2 LiDAR – Far-Field Beam Quality Control

    Whether for automotive-grade or industrial-grade LiDAR, beam quality control is an essential consideration. Excessive divergence angle causes far-field spot expansion, reducing optical transmission efficiency, decreasing detection range and resolution, and increasing power consumption.


    Application Scenario

    Impact of Divergence Angle

    Testing Value

    905nm EEL Solution

    Edge-emitting lasers have large divergence angles (fast axis 30–40°, slow axis 10–15°)

    Accurately measure fast- and slow-axis divergence angles to guide fast-axis collimation (FAC) lens design

    VCSEL Solution

    Smaller divergence angle (~20–25°)

    Evaluate individual emitter quality; screen for consistent devices

    1550nm Fiber Laser Solution

    Fiber output has good beam quality, but seed source still requires screening

    Screen seed sources with consistent divergence angles for production uniformity


    Typical Users: LiDAR companies, VCSEL chip suppliers


    3.3 Laser Pump Sources – Pump Coupling Efficiency Optimization

    Semiconductor lasers (LDs) are often used as pump sources for fiber lasers or solid-state lasers. Their divergence angles directly affect the coupling efficiency of pump light into the gain medium.


    Application Scenario

    Impact of Divergence Angle

    Testing Value

    Fiber Laser Pumping

    Pump LD divergence affects coupling efficiency into gain fiber

    Screen pump sources with consistent divergence angles to improve overall system efficiency

    Solid-State Laser Pumping

    Pump divergence affects end-pumped mode matching

    Optimize pump optical path design to improve optical-to-optical conversion efficiency

    Pump Source Aging Monitoring

    Divergence angle may degrade over long-term operation

    Periodic divergence angle testing to assess pump source lifetime


    Typical Users: Fiber laser manufacturers, solid-state laser manufacturers


    【Technical Background】Mechanisms of Divergence Angle Impact on Pump Coupling Efficiency

    1. Divergence Angle as a Key Factor in Pump Coupling Efficiency

    When a semiconductor laser serves as a pump source, the divergence angle of its output beam directly affects the optical coupling efficiency into the pump medium (fiber or laser crystal). For a typical semiconductor laser chip, the large difference between its fast-axis divergence angle (20–60°) and slow-axis divergence angle (6–20°) results in a low proportion of the beam focused into the fiber, which significantly affects optical performance. Studies show that the numerical aperture angle of multi-mode silica fibers is generally less than 40°; beam divergence exceeding this angle cannot be coupled into the fiber.


    Typical Data: By optimizing the wedge angle and tip radius of cylindrical lensed fibers, coupling efficiency for mid-infrared LDs can reach over 97% when the mode-field radius of the fiber matches the initial spot size of the laser in the slow-axis direction. Using a graded refractive index (GRIN) lens coupling system, experimental coupling efficiency of 90.8% has been achieved for LD-to-multimode fiber coupling.


    2. Impact of Divergence Angle on Solid-State Laser Pumping

    In LD end-pumped solid-state lasers, the pump beam divergence angle directly affects the mode matching with the oscillating laser mode. The beam quality parameter (BPP – Beam Parameter Product) is commonly used to evaluate laser diode beam quality, defined as the product of beam waist radius and far-field divergence angle. By optimizing the pump divergence angle, optimal mode matching can be achieved, improving optical-to-optical conversion efficiency.


    3. Beam Quality Degradation at High-Power Operation

    In high-power operation of broad-area semiconductor lasers, waste heat causes thermal lensing effects that significantly increase the slow-axis far-field divergence angle, leading to severe beam quality degradation and reduced pump coupling efficiency. Research shows that when the working distance offset between the incident beam waist and the fast-axis collimation (FAC) lens increases from 0 μm to 2 μm, the divergence angle of a single emitter after collimation in the fast axis increases from 4.95 mrad to 6.46 mrad. Regular divergence angle testing enables pump source condition monitoring and early warning of performance degradation.


    4. Typical Coupling Efficiency Data

    Research / Source

    Application Scenario

    Optimized Coupling Efficiency

    Wang et al., Applied Optics (2025)

    2 µm band LD-fiber coupling, wedge-shaped cylindrical lensed fiber

    >97%

    Ma et al., Optical Fiber Technology (2024)

    LD to multimode fiber via GRIN lens (experimental)

    90.80%

    Gao et al., SPIE Proceedings (2002)

    Diode laser lens duct coupling

    85.00%

    NIH/PMC Study (2024)

    Arrayed semiconductor laser rotational polarization optical model

    89.04%


    3.4 Research and Device Development – Temperature-Divergence Relationship Studies

    During the chip design phase, divergence angle is an important indicator for evaluating epitaxial structure and waveguide design. When paired with BIM-60/66 series spectrometers and BIM-740x/710x series optical power meters, the system enables comprehensive evaluation of device temperature characteristics.


    Research Topic

    Role of Divergence Angle Testing

    Companion Equipment

    Temperature Characterization

    Measure divergence angle variation at different temperatures

    BRM-620X TEC controller + temperature-controlled mounting socket

    Current Dependence Study

    Measure divergence angle variation at different drive currents

    BRM-610X driver controller

    Spectrum-Temperature Relationship

    Measure spectral changes at different temperatures; analyze wavelength drift coefficient

    BIM-60/66 series spectrometers

    Power-Temperature Relationship

    Measure output power at different temperatures; evaluate thermal stability

    BIM-740x/710x series optical power meters

    Aging Reliability

    Monitor divergence angle drift during aging

    Long-term testing + OPTIED platform data logging

    Batch-to-Batch Consistency

    Evaluate production lot variation

    Batch testing + statistical data analysis


    Typical Users: Chip design houses, assembly houses, university optoelectronics laboratories


    3.5 Micro-LED Display – Angular Characteristics and Color Shift Evaluation

    In Micro-LED display technology R&D, angular characteristics are a key parameter affecting display quality.


    Research Topic

    Role of Divergence Angle Testing

    Industry Challenge

    RGB Chip Angle Matching

    Measure angular distribution of different colors and sizes of Micro-LEDs

    Inconsistent emission angles among RGB chips cause color shift

    Encapsulation Process Impact

    Evaluate effect of encapsulation materials on angular distribution

    Encapsulation enlarges blue/green emission angles, significantly reducing CCT

    Microcavity Effect Study

    Measure angular emission variation as chip size decreases

    Double-peak phenomenon in small chips affects display uniformity

    Light Extraction Efficiency Optimization

    Correlate angular distribution with light extraction efficiency

    Increased sidewall emission reduces on-axis intensity


    Application Scenarios:

    • Micro-LED Display Module R&D: Evaluate angular emission matching of RGB chips of different sizes

    • Post-Mass-Transfer Inspection: Batch-test emission uniformity of transferred chips

    • Encapsulation Process Optimization: Evaluate impact of different thickness/materials on emission angle


    Typical Users: Micro-LED display chip R&D institutions, panel manufacturers, AR/VR device makers


    Testing Method Note: For single Micro-LED chips, the BRM-6301 can be paired with a high-precision probe station and microscopic imaging system for detailed angular characteristic studies.


    Part 4: Comparative Advantages Over Traditional Methods

    Aspect

    Traditional Beam Profiler

    Brolight BRM-6301 System

    Measurement Principle

    CCD imaging; limited by sensor size

    Rotating device under test; full-angle scanning (device mounted on temperature-controlled socket)

    Large-Divergence Measurement

    Not capable (large errors >30°)

    Purpose-built; full-angle coverage (-90° to +90°)

    Packaging Level Coverage (Key Differentiator)

    Requires custom fixtures for each packaging level

    BRM-67xx series sockets support unpackaged/partially packaged/fully packaged devices – one platform for all packaging levels

    Temperature Control

    None, or external

    BRM-620X TEC controller; ±0.1°C precision

    Drive Capability

    Requires external current source

    BRM-610X driver controller; programmable current

    Spectral Analysis

    Not available

    Optional BIM-60/66 series spectrometers for spectrum-temperature analysis

    Optical Power Measurement

    Not available

    Optional BIM-740x/710x series optical power meters for power-temperature analysis

    Data Correlation

    Data silos; manual recording

    OPTIED platform unifies instrument control, data acquisition, and correlative analysis

    Output Format

    Beam spot image; requires manual interpretation

    Polar/Cartesian coordinate plots; automatic half-intensity angle output

    Report Generation

    Manual compilation; time-consuming

    One-click test report output; automatic archiving

    Operational Complexity

    Complex optical alignment

    One-click fully automated measurement


    Part 5: Typical Test Workflow Example

    Scenario: Test divergence angle of a COS device at 25°C and 60°C, with correlated P-I-V curve analysis


    Step

    Operation

    Relevant Models

    Data Obtained

    1

    Mount COS device in BRM-6701 temperature-controlled socket

    BRM-6701

    Device fixation, electrical connection

    2

    Set TEC temperature to 25°C; start test after stabilization

    BRM-620X

    Temperature stable at 25±0.1°C

    3

    BRM-6301 automatically rotates detector to measure angular distribution

    BRM-6301

    Polar/Cartesian coordinate divergence angle plots

    4

    BRM-610X automatically sweeps drive current; records P-I-V

    BRM-610X

    P-I-V curves, threshold current, WPE

    5

    Raise TEC temperature to 60°C; repeat Steps 3–4

    BRM-620X + OPTIED platform

    Divergence angle + P-I-V data at elevated temperature

    6

    OPTIED platform automatically performs correlative analysis

    OPTIED integrated platform

    Temperature-divergence relationship; temperature-threshold current relationship


    Research Value: Through this workflow, researchers can directly answer fundamental questions such as "By how much does the divergence angle increase when temperature rises by 10°C?" and "How much does the threshold current drift at elevated temperatures?"


    Figure 7 shows a measured example of a COS chip.

    figure-7-partially-packaged-cos-device-testing-example.jpg

    Figure 7: Partially packaged (COS) device testing example


    Part 6: Summary of User Value

    For Chip Design Houses

    • Verify rationality of epitaxial structure and waveguide design

    • Evaluate batch-to-batch consistency

    • Provide reliable divergence angle datasheet specifications to downstream customers


    For Assembly Houses

    • Rapid incoming chip screening

    • Evaluate impact of assembly processes on divergence angle

    • Provide factory test reports for TO-packaged devices


    For Optical Transceiver Module Manufacturers / System Integrators

    • Accurately measure divergence angle to optimize coupling optical design

    • Evaluate performance differences among suppliers

    • Establish incoming inspection standards


    For Research Laboratories

    • Multi-parameter correlative analysis (temperature, current, divergence angle, efficiency)

    • Integrated test platform improves experimental efficiency

    • Support custom test sequences for exploratory research


    For Micro-LED R&D Institutions

    • Evaluate angular matching of RGB chips of different sizes

    • Study impact of encapsulation processes on emission angle

    • Provide data support for color shift optimization


    Comprehensive Light-Emitting Device Performance Parameter Characterization

    Commercial LD and LED products are typically characterized by key performance indicators in their datasheets. The Brolight BRM-6301 test platform and supporting ecosystem can completely provide measurement and validation of the following specification parameters:


    Parameter

    Symbol

    Brolight Capability

    Center Wavelength

    λ₀

    BIM-60/66 series spectrometers: Measure spectral characteristics at different temperatures/currents; analyze wavelength drift

    Continuous Output Power

    P_op

    BIM-740x/710x series optical power meters: Accurately measure output optical power

    Threshold Current

    I_TH

    BRM-610X driver controller + OPTIED platform: Automatically sweep P-I-V curves; extract threshold current

    Operating Current

    I_op

    BRM-610X driver controller: Record operating current at rated output power

    Operating Voltage

    V_op

    BRM-610X driver controller: Simultaneously measure device voltage

    Slope Efficiency

    η

    OPTIED platform: Automatically calculate slope efficiency from P-I curve

    Monitor Current

    I_pd

    BRM-610X driver controller: Configurable PD monitor channel

    Divergence Angle (Parallel Direction)

    θ_∥

    BRM-6301 divergence angle analyzer: Full-angle scanning; automatic half-intensity angle output

    Divergence Angle (Perpendicular Direction)

    θ_⊥

    BRM-6301 divergence angle analyzer: Full-angle scanning; automatic half-intensity angle output


    Customer Value: The Brolight BRM-6301 test platform is not just a "divergence angle analyzer" – it is a complete test solution covering all key performance parameters of light-emitting devices. From P-I-V curves to spectral characteristics, from divergence angle to temperature dependence – all data is uniformly acquired, correlatively analyzed, and can be exported as a single test report in industry-standard format through the OPTIED platform, ready for use in product datasheet compilation or incoming inspection.


    Conclusion

    The Brolight BRM-6301 Divergence Angle Analyzer, together with the OPTIED Control & Data Platform and the complete driver, temperature controller, and fixture ecosystem, is more than an instrument for divergence angle characterization of light emitters – it is an integrated photonics test platform that combines driver, temperature control, multi-level fixtures, spectral analysis, optical power measurement, and correlative data analysis.


    From bare die to module, from single emitters to Micro-LED fine angular studies, from divergence angle to P-I-V curves, from spectrum-temperature to power-temperature relationships – the Brolight test platform delivers comprehensive characterization across the full spectrum of light-emitting devices, helping you truly "see" the full picture of your devices.


    References

    1. Wang, Z., et al. "High coupling efficiency wedge-shaped cylindrical lensed fiber for the 2 µm band." Applied Optics, Vol. 64, Issue 15, pp. 4265-4270 (2025).

    2. Ma, Z., et al. "Coupling efficiency of laser diode to multimode fiber by graded refractive index lens." Optical Fiber Technology, Vol. 83, 103689 (2024).

    3. "Power Enhancement and Spot Homogenization Design for Arrayed Semiconductor Lasers." Micromachines, Vol. 15, Issue 6, 744 (2024). National Institutes of Health (NIH/PMC).

    4. Gao, Q., Wang, W., Pang, Y. "Diode-laser transversal pumped coupling technology." Proceedings of SPIE, Vol. 4915, pp. 346-349 (2002).

    5. Zhang, H., et al. "The SMILE Effect in the Beam Propagation Direction Affects the Beam Shaping of a Semiconductor Laser Bar Array." Photonics, Vol. 11, Issue 2, 161 (2024). MDPI.


    About Brolight

    Brolight, a brand under A&P Instrument, was established in 2012 and is headquartered in Hangzhou, China. As a national high-tech enterprise specializing in the R&D, manufacturing, and sales of scientific educational instruments and photonics instruments, Brolight holds ISO9001:2015 quality management system certification. Leveraging over 40 years of deep expertise in the photonics industry accumulated by its parent company, Brolight is committed to delivering high-quality photonics testing solutions to research and industrial users worldwide.


    Contact Us

    For more information, technical specifications, or to request a demonstration, please visit our website or contact our sales team. We look forward to supporting your photonics testing needs.

    • Website: www.ibrolight.com

    • Tel: +86-153 3689 0307

    • Email: info@ibrolight.com

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